Charged EVs magazine published a great article in their newest issue on "The Future of Integrated Inverter Modules: Press-fit solderless interconnects and smarter design".
The article provides an excellent overview on the driving factors in the automotive industry that are radically altering the challenges facing design engineers tasked with creating next-gen inverter modules.
With efficiency and cost the keys to success, finding a way to reduce overall inductance and inverter size while improving manufacturing methods have become critical.
The author, Michael Kent, did extensive research on the factors impacting power efficiency and much of the article focuses on the detrimental impacts of inductance, which is the primary"efficiency killer".
The article also drills down and explores how solderless press-fit interconnects and advanced packaging methods can dramatically reduce inductance problems while also making inverters easier to manufacture.
For more information, read the entire Charged EVs article here.
You might also find of interest these Tech Bulletins on related topics:
- IGBT Power Modules for the Next Generation
- Busbar Connectivity and Integration
- Trends in Power Module Packaging
