Card-edge interconnects are critical for the success of a wide range of today's electronics assemblies, especially those involving mother-board to daughter-board or other PCB-to-PCB connection requirements.
Maximizing production efficiency typically requires that the mother-board be fully assembled and tested prior to integration of daughter-boards. Also board assembly processes need to be optimized for high-automation, mixed-technology, SMT production, with secondary processes kept to a minimum. Finally, it's important to not risk damage to components by reheating completed assemblies during secondary soldering steps.
The combination of SMT Card-edge connectors with solder-free compliant Press-Fit technology has moved to the forefront as the go-to solution for most PCB-to-PCB interconnect requirements.
This overcomes a number of key challenges, including:
- Avoiding any heating of the completed mother-board, such as secondary soldering processes
- Minimizing the interconnect footprint on densely populated mother-boards
- Maximizing automated assembly processes for both mother-boards and daughter-boards
- Reducing the high costs associated with using conventional edge-card connectors
- Assuring sufficient current-carrying capacity through the daughter-board interconnects
- Providing a high degree of mechanical strength between the boards
To get details on the how to optimize your multi-board designs with the combination of standards-based SMT and solderless compliant interconnect technologies, download the Two-Part Tech Bulletin Series on SMT Card-edge Press-Fit Interconnects.
