Press-fit technology has come a long way over recent years and has been adapted for use in a wide range of applications in diverse industry segments, including automotive, power modules, transportation, industrial equipment, communication systems, appliances, lighting, utilities, green energy, mobile devices, wearable electronics and many other consumer products.
Performance testing has confirmed that solder-free Press-fit pins satisfy stringent operational requirements, including qualification to high temperatures, vibration, shock, and have excellent thermal expansion (CTE) characteristics for improved performance over extended product lifecycles.
However, as with any significant design program, it is vital to consider all of the relevant factors up front in order to get the best results out of your press-fit investments. No new journey should be undertaken without a road map. That's why we've created the Press-Fit Applications Evaluation Checklist.
In addition to this overview checklist, you can drill down into detail on virtually any related topic by visiting the full library of Interplex Press-Fit Tech Bulletins.
