Electronic modules, sensors and MEMs applications are proliferating throughout a variety of industries and are driving a need for new and better methods for creating interconnections - both internally within the modules and also to provide external connections from the modules.
Many applications utilizing electronic systems need fully Integrated, modular, ‘plug & play’ package units with multiple internal connection platforms that support the combination of various technologies from chip-level up through mini-board and module level.
Even as feature-rich complexity of the module designs continues to increase, the associated interconnect complexity needs to be held to a minimum.
The optimal approach is to combine injection molding with fine precision stamping of metal interconnection platforms that are plated for a variety of application-specific wire bond requirements.
By holding down the number of interconnection levels and reducing interconnect complexity, the overall packaging design can be optimized to match application performance needs while also improving yields, boosting reliability and reducing production costs.
Considering all of the issues involved with designing and developing both package technology and interconnection technology, the need for complementary integration of both disciplines has now become the ideal solution.
This enables the production of complex feature sensor housings that suit a range of applications from automotive systems to consumer product units and other emerging applications. Combined with the capability of producing wire-bondable surfaces with precious metal finishes, this integrated approach to housing manufacture offers the module designer opportunities to reduce costs by bonding sensor parts, along with control elements directly into the housings.
To see how it all fits together, you can download the detailed Tech Bulletin here.
