Let's face it. Some things just naturally belong together.
Press-Fit/Compliant technology and insert molded plastic electronic modules are definitely one of those perfect matches that makes a lot of sense from the start and then just keeps getting better with time.
Electronic modules in plastic housings always need a way to connect with the outside world, whether the module is a sensor, power module, smart junction box, control unit, or virtually any other electronic function that can be enclosed in a plastic housing. This requires an effective method for creating a robust electrical interconnection between the "inside" circuitry and the "outside" circuitry.
In many cases, the finished module needs to be a "pluggable" unit that can be integrated within the larger system in a quick, reliable and preferably solder-free manner. This is where press-fit has become such a widely used go-to solution.
Performance testing has demonstrated that Press-Fit pins satisfy stringent operational requirements as defined by IEC, EIA and SAE specifications and they have been qualified to 150° C temperatures. Depending on the pin configuration, Press-Fit interconnects can provide retention force of up to 14 lbs.
The inherent advantages of solderless assembly, simplified manufacturing processes, robust thermal characteristics and adaptability into a variety of high-volume stamping configurations make press-fit pins the preferred option for many module design projects.
If you're considering the use of press-fit in insert molded plastic electronic modules, it's a good idea to read this tech bulletin that drills down into the key design considerations to assure success.
The specific areas covered include:
• Using shoulder design for shut-off of plastic around press-fit zone
• PCB locating posts to assist with staging and pressing PCB on to press-fit pins
• PCB Z axis positioning stops
• PCB hold down options
• Managing bend-radius for spring-based material
• Maintaining proper PCB edge distance and force management
