Soldering continues to be the most widely used method for attachment of components on printed circuit boards (PCBs) and also for implementing a diverse range of interconnects between PCBs (mother-boards, daughter-boards, modules, etc.).
With conventional soldering processes, the metal components are first brought into position and mechanically held in place. Then flux and solder are applied to the conjoined parts, typically by a dipping process. The biggest issue with conventional soldering is the inability to consistently assure precise and complete coverage of the desired areas on the pad and pin, which can result in variances of solder joint quality and reliability.
In contrast, Solder-Bearing Lead (SBL) technology creates leads and components that have a precise amount of solder already on them, which assures correct coverage, proper solder flow and 100% solderability. SBL also reduces production costs by eliminating secondary solder/flux application steps, streamlining the production flow and minimizing rework and scrap.
