Growth in the electrification of automobiles, transportation systems and green-power applications is
driving a whole new set of challenges in the design and packaging of power conversion and
power management devices. Reducing size and improving power efficiency are critical factors for success.
Interconnecting sub-assemblies and elements within the power module requires a much more integrated approach than traditional bolt-on methodologies. With new chip-level power devices offering much better performance and efficiency, conventional interconnect methods also need a makeover to ensure that chip-level performance improvements carry through to the module level as well.
High-force, high-power press-fit technologies offer an excellent method for both enhancing power efficiency and streamlining of assembly processes.
New-generation power device design is moving toward an increased emphasis on tight integration
from the chip level all the way up through subassemblies and the module level. The ideal approach is
to leverage interconnect methods that enable subassemblies at each level to become seamlessly
pluggable and integral elements of the overall assembly.
Press-Fit technology is a proven solution for creating high power reliable electro-mechanical interconnects without using solder. Performance testing has demonstrated that Press-Fit pins satisfy stringent operational requirements as defined by IEC, EIA and SAE specifications and they have been
qualified to 150° C temperatures. Depending on the pin configuration, Press-Fit interconnects can provide retention force up to just over to 22lbs.
Key advantages include:
- More efficient than solder in power connections
- Ability to conduct high current
- Direct connect to PCB hole allows for effective heat and current transfer
- Remains compliant to compensate for CTE mismatch between subassemblies
- Solder free and pluggable no heat needed for assembly
- Compatible with controlled and automated assembly methods
In addition, the configurability of press-fit technology enables interconnects to be implemented directly as part of other elements in the design, such as lead-frames, bus-bars, module housings, etc. Designers thus gain much more flexibility for making interconnects a fundamental part of their overall power module architecture.
To learn more, download the Tech Bulletin on Using High-Force Press-Fit for Next-Gen Power Modules
