Visit Interplex at the Electric & Hybrid Tech Expo in Novi, Michigan, September 15-17, 2015 (Booth #929) to learn how Interplex's power module packaging solutions create high levels of inverter efficiency.
We leverage our knowledge of interconnect technology, especially our press-fit technology, to create application-specific power module interconnect solutions, power module integration systems and IGBT power module packaging solutions to meet the demanding needs of the electric and hybrid vehicle market.
THE INTERPLEX ADVANTAGE
Interplex Engineers will be on hand at the Electric & Hybrid Vehicle Technology Expo to discuss Interplex's:
- Engineered Application Specific Solutions
- High force pluggable solder free interconnects
- Multilayer Molded Bus Bar integration
- CTE compliant, high current connections
- Reduced current paths = lower inductance
- Thermally efficient direct connections
- Integrated Stackable ease-of-assembly solutions
In addition, the engineers will review customer applications and provide feedback on ways to maximize inverter efficiency for interested customers.
To set up an appointment in advance, contact power@us.interplex.com
If you can't make the show, click here to learn more about Interplex Power Solutions.
