The evolution of electronically controlled automotive features already encompasses a variety of functions such as GPS navigation systems, anti-lock brakes, vehicle stability control, hybrid drivetrains, and tire pressure monitors.
This on-going transformation of automotive technology has now shifted into a higher gear with the development of autonomous driverless cars that include car-to-car communication, infrastructure information sharing, automatic parking and more.
The spread of these electronic capabilities and their importance for safety and core automotive functionality has raised the bar with regard to reliability of all elements that make up and interconnect the underlying systems.
Design Challenges
Some of the key interconnect challenges include:
- Ambient temperatures ranging from -40°C to +150°C (SAE Class II-IV)
- Ability to handle constant thermal cycling, vibration and shock
- High current-carrying capacities of up to 30 amps
- Flexibility for interconnecting a variety of substrates (FR4, ceramic, metal, etc.)
- Ability to connect power devices with complex control circuitry
- Capability to embed interconnects within sensors and molded housings
- Embedding RF shielding to protect signal integrity and reduce interference
Applicable Technologies
- Press-fit compliant interconnects take the solder out and put more reliability in for a widening range of automotive applications. Interplex’s Press-Fit technology is designed and tested to meet standard automotive requirements for vibration, mechanical & thermal shock for temperatures up to 150° C, as defined by the IEC, EIA and SAE.
- RF Shielding is an increasingly critical element in automotive designs, driven by the growth of wireless and wired communications links, both within the vehicle and to external applications. As automotive assemblies become more complex and smaller, the use of Solder-Bearing RF Shielding may become an important method for assuring shield integrity and streamlining the manufacturing process.
- Modular sensor assemblies have long been an important part of automotive electronics and are becoming even more pervasive with the evolution of the intelligent automobile. Optimizing sensor housing modules design and manufacturing is a critical factor for these new applications. Also, the ability to integrate press-fit into plastic electronic modules both improves interconnect reliability and simplifies the module assembly process.
- Flex circuits have also become an important element within and between automotive assemblies and sub-assemblies to improve configuration flexibility, provide higher circuit density and significant savings in weight, space and cost vs. traditional PCB connectors, cabling, and wire harnesses. Solder-bearing flex circuits offer a clear advantage of 100% solderability and easier assembly.
Key Factors for Success
- Involve component designers early in the overall product development process
- Leverage the ability to integrate interconnects within custom stampings
- Make sure interconnects meet strict automotive environmental requirements
- Use holistic design approach to integrate functions and streamline assembly
