Creating optimal interconnects within micro-electronic components, such as semiconductors, MEMS devices, sensors and other integrated modules, requires an approach that is rugged, reliable, keeps down production cost and minimizes complexity.
Wire bonding has long been the leading methodology for making interconnects within modules. Driven by a widening range of application requirements, wire bonding is being used to seamlessly meet the needs for interconnects at a variety of levels, including within the module itself, between internal devices and also to the substrate.
However, successful wire bonding is critically dependent on having proper surface finish on the the components and the substrates. To meet today's application requirements, this necessitates processes that can incorporate a variety of electroplated finishes on to structural components as part of the custom stamping process.
