Electronic modules, sensors and MEMs applications are proliferating throughout a variety of industries and are driving a need for new and better methods for creating interconnections - both internally within the modules and also to provide external connections from the modules.
Many applications utilizing electronic systems need fully Integrated, modular, ‘plug & play’ package units with multiple internal connection platforms that support the combination of various technologies from chip-level up through mini-board and module level.
Even as feature-rich complexity of the module designs continues to increase, the associated interconnect complexity needs to be held to a minimum.
The optimal approach is to combine injection molding with fine precision stamping of metal interconnection platforms that are plated for a variety of application-specific wire bond requirements.
