Interplex Junction - The Place to Connect

Busbar Design is Critical Backbone for Power Applications

Posted by Power Products Design Team

Mar 26, 2015 11:28:00 AM

Amid the continuing changes and evolution of module designs in the automotive, power, industrial, motor, and other markets, one thing remains true: busbars still form the backbone for conducting significant current levels within and between assemblies.

busbarsHowever, as power applications are becoming smaller, faster and more complex, the integration of busbar functionality is undergoing significant evolution as well. 

The keys to success are:

  • Minimizing contact resistance
  • Assuring lifecycle thermal performance
  • Reducing product size
  • Ensuring power efficiency
  • Streamlining assembly and lowering costs

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Topics: power modules

Charged EV article: The Future of Integrated Inverter Modules

Posted by Automotive Design Team

Mar 17, 2015 9:00:00 PM

Charged EVs magazine published a great article in their newest issue on "The Future of Integrated Inverter Modules: Press-fit solderless interconnects and smarter design".  

Interplex-ChargedEVs-article

The article provides an excellent overview on the driving factors in the automotive industry that are radically altering the challenges facing design engineers tasked with creating next-gen inverter modules.

With efficiency and cost the keys to success, finding a way to reduce overall inductance and inverter size while improving manufacturing methods have become critical.

The author, Michael Kent, did extensive research on the factors impacting power efficiency and much of the article focuses on the detrimental impacts of inductance, which is the primary"efficiency killer".  

Interplex-PQ1

The article also drills down and explores how solderless press-fit interconnects and advanced packaging methods can dramatically reduce inductance problems while also making inverters easier to manufacture.

For more information, read the entire Charged EVs article here.

 

You might also find of interest these Tech Bulletins on related topics:

 

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Topics: power modules

Trends Toward More Efficient Automotive Inverter Power Modules

Posted by Automotive Design Team

Feb 19, 2015 9:51:00 AM

The ongoing trends in electrification of automobiles, trucks and commercial transportation systems are driving a series of important changes in the way inverters and power modules are designed, manufactured and integrated with other systems in the vehicles.

Typically, modern inverters are built around high-power insulated-gate bipolar transistors (IGBTs) that handle all of the electronic switching functions at the heart of the process. A number of subassemblies and components, such as control boards, busbars, current sensors, capacitor banks, cooling circuits, etc., surround the IGBT. When integrated together, all of these elements comprise the functional inverter stack.

 

Traditional interconnect methods in IGBT power module packaging, such as bolting and welding harness connections cannot keep up with today’s requirements because they are inefficient, cumbersome, and assembly-process intensive. They result in larger assemblies with longer current paths and higher overall inductance.

In contrast, the efficient design of IGBT inverters and power module integration by using pluggable, high-force, press-fit technology can significantly improve power efficiency, reduce the bill-of-material costs, decrease assembly complexity and shrink the overall physical size of the power assembly.

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Topics: power modules, automotive

Using High-force Press-Fit to Enable Next-generation Power Modules

Posted by Press-Fit Team

Nov 20, 2014 5:28:46 PM

Growth in the electrification of automobiles, transportation systems and green-power applications is
driving a whole new set of challenges in the design and packaging of power conversion and
power management devices.  Reducing size and improving power efficiency are critical factors for success.

PowerModuleWithPressFit

Interconnecting sub-assemblies and elements within the power module requires a much more integrated approach than traditional bolt-on methodologies. With new chip-level power devices offering much better performance and efficiency, conventional interconnect methods also need a makeover to ensure that chip-level performance improvements carry through to the module level as well.

High-force, high-power press-fit technologies offer an excellent method for both enhancing power efficiency and streamlining of assembly processes.

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Topics: power modules

Press-Fit and Insert Molded Plastic Modules - A Perfect Marriage

Posted by Press-Fit Team

Apr 14, 2014 8:41:00 AM

Let's face it.  Some things just naturally belong together.

Press-Fit/Compliant technology and insert molded plastic electronic modules are definitely one of those perfect matches that makes a lot of sense from the start and then just keeps getting better with time.

PressFit-module

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Topics: module design & manufacturing, sensors, Press-Fit compliant interconnects, power modules, insert-molding