Interplex Junction - The Place to Connect

Creating optimal interconnects within micro-electronic components, such as semiconductors, MEMS devices, sensors and other integrated modules, requires an approach that is rugged, reliable, keeps down production cost and minimizes complexity.  

Wire bonding has long been the leading methodology for making interconnects within modules. Driven by a widening range of application requirements, wire bonding is being used to seamlessly meet the needs for interconnects at a variety of levels, including within the module itself, between internal devices and also to the substrate. 

However, successful wire bonding is critically dependent on having proper surface finish on the the components and the substrates.  To meet today's application requirements, this necessitates processes that can incorporate a variety of electroplated finishes on to structural components as part of the custom stamping process.

Electronic modules, sensors and MEMs applications are proliferating throughout a variety of industries and are driving a need for new and better methods for creating interconnections - both internally within the modules and also to provide external connections from the modules. 

Many applications utilizing electronic systems need fully Integrated, modular, ‘plug & play’ package units with multiple internal connection platforms that support the combination of various technologies from chip-level up through mini-board and module level.

Even as feature-rich complexity of the module designs continues to increase, the associated interconnect complexity needs to be held to a minimum.

The optimal approach is to combine injection molding with fine precision stamping of metal interconnection platforms that are plated for a variety of application-specific wire bond requirements.