Creating optimal interconnects within micro-electronic components, such as semiconductors, MEMS devices, sensors and other integrated modules, requires an approach that is rugged, reliable, keeps down production cost and minimizes complexity.
Wire bonding has long been the leading methodology for making interconnects within modules. Driven by a widening range of application requirements, wire bonding is being used to seamlessly meet the needs for interconnects at a variety of levels, including within the module itself, between internal devices and also to the substrate.
However, successful wire bonding is critically dependent on having proper surface finish on the the components and the substrates. To meet today's application requirements, this necessitates processes that can incorporate a variety of electroplated finishes on to structural components as part of the custom stamping process.
Housings or electronic packages that are specifically designed for Sensors, MEMs devices and semiconductor chip devices will incorporate the need for die attach technology as well as wirebond technology to interconnect the components, typically bare die. The small sizes of such housings dictate that the surface finish of the die attach location and the output leads / contacts for wirebonding should be the same and work for different die attach methods (solder, epoxy) and wirebonding techniques (ultrasonic-sonic; thermosonic; thermo-compression), despite the diff erences of the attachment and materials technologies.
The interconnect elements such as stamped leadframes need to accommodate a range of wirebond types (ball bonding, wedge bonding, ribbon bonding, clip bonding or TAB bonding) as well as a variety of plating options (Cu, AI, Au).
In today's environment, this means treating the interconnect design and plating process as a fundamental element for overall success by making it a key part of the early design process.
Read more by downloading this detailed whitepaper on Wirebondable Plating.
