Visit Interplex at the Electric & Hybrid Tech Expo in Novi, Michigan, September 15-17, 2015 (Booth #929) to learn how Interplex's power module packaging solutions create high levels of inverter efficiency.
We leverage our knowledge of interconnect technology, especially our press-fit technology, to create application-specific power module interconnect solutions, power module integration systems and IGBT power module packaging solutions to meet the demanding needs of the electric and hybrid vehicle market.
