Visit Interplex at the Electric & Hybrid Tech Expo in Novi, Michigan, September 15-17, 2015 (Booth #929) to learn how Interplex's power module packaging solutions create high levels of inverter efficiency.
We leverage our knowledge of interconnect technology, especially our press-fit technology, to create application-specific power module interconnect solutions, power module integration systems and IGBT power module packaging solutions to meet the demanding needs of the electric and hybrid vehicle market.
However, as power applications are becoming smaller, faster and more complex, the integration of busbar functionality is undergoing significant evolution as well. 
