An expanding range of industries is already relying on solder-free Press Fit technology as a key linchpin in their electronics assembly strategies.
Because so many companies now depend on press-fit, it has become critically important for suppliers of compliant interconnects to provide in-depth testing, documentation, applications-support, and stringently controlled manufacturing processes.
This technology offers an excellent alternative for creating reliable electro-mechanical interconnects without using solder and are being used in demanding applications such as PCB-to-PCB stacking interconnects, fuse holders, molded modules, smart junction boxes, controllers, lighting and a variety of other custom applications.
Performance testing has proven that compliant pins can satisfy stringent operational requirements as defined by IEC, EIA and SAE specifications and they have been qualified to 150° C temperatures. Depending on the pin configuration, compliant interconnects can provide retention force of up to 120 Newtons and current carrying capacity of 35 amps or more through a single press-fit eye.
To assure that specified electrical and mechanical properties are consistently achieved on every assembly, the interconnects must uniformly conform to very exacting parameters. This is especially critical for high-volume global production situations, where all of the products made throughout the world need to yield consistent results.
Customers using press-fit must expect and demand that suppliers address these key issues:- Design and testing standards
- Documentation and applications support
- Raw materials selection and plating process controls
- Global tooling standards, inspection criteria and production control plans
- Worldwide functional testing and application support capabilities
To read more details, download the Tech Bulletins on Supplier Best Practices for Press Fit
