Compliant press-fit technology has already become a mainstay for implementing highly reliable solder-free interconnects in new products throughout the automobile industry, power module desgns, industrial products and other applications. The advantages of press-fit that were proven in the lab have also been demonstrated by extensive field deployments.
These advantages are now driving a new wave of upgrade conversions from solder-joints to press-fit, typically as part of periodic product redesigns, retrofits and new-version releases. The benefits of conversion generally have clear ROI payback because press-fit rarely necessitates any changes to the core product design.
As more manufacturers look at converting existing designs some of the key decision factors include:
• Are changes or updates planned that could open opportunities for retrofit?
• Are secondary solder processes hurting product yields.
• What has been the field quality and reliability experience?
• Is the product exposed to temperature cycling and other environmental stress?
• Are solderjoint failures a cause of field quality problems?
There are also a number of key considerations that should be taken into account to assure a successful conversion. These include:
- PCB hole size and plating control
- Press-fit pin lengths
- Press-fit assembly forces
For more information, read the detailed Tech Bulletin on Press-Fit vs Solder-joints, the Why, When and How of Upgrading
